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tps714xx www.ti.com sbvs116c C december 2008 C revised march 2011 80ma, 10v, 3.2 a quiescent current low-dropout linear regulator in sc70 or son 2x2 1 features description the tps714xx low-dropout (ldo) voltage regulators 2 ? wide input voltage range: 2.5v to 10v offer the benefits of wide input voltage range, ? low quiescent current: 3.2 a at 80ma low-dropout voltage, low-power operation, and ? stable with any capacitor > 0.47 f miniaturized packaging. these devices, which operate over an input range of 2.5v to 10v, are ? output current: 80ma stable with any capacitor 0.47 f. the 2.5v to 10v ? dropout voltage: 415mv at 50ma load input voltage range, combined with 3.2 a quiescent ? available in fixed 3.3v or adjustable (1.2v to current, makes this device particularly well-suited for 8.8v) versions two-cell alkaline, and two-cell lithium, and other low quiescent current sensitive battery applications. the ? current limit low dropout voltage and low quiescent current allow ? sc70-5 and 2mm x 2mm son-6 packages operation at extremely low power levels. therefore, ? specified junction temperature range: the devices are ideal for power battery management C 40 c to +125 c ics. specifically, because the device is enabled as soon as the applied voltage reaches the minimum ? for msp430-specific output voltages, see the input voltage, the output is quickly available to power tps715xx continuously-operating, battery-charging ics. applications the typical pnp pass transistor has been replaced by a pmos pass element. because the pmos pass ? ultralow-power microcontrollers element behaves as a low-value resistor, the low ? industrial/automotive applications dropout voltage (typically 415mv at 50ma of load ? pdas current) is directly proportional to the load current. the quiescent current (3.2 a, typical) is stable over ? portable, battery-powered equipment the entire range of the output load current (0ma to 80ma). the tps714xx is available in a 2mm x 2mm son-6 package ideal for high power dissipation, or an sc70-5 package ideal for handheld and ultra-portable applications. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 2008 C 2011, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. tps71433 out in gnd msp430 9v drv package 2mm x 2mm son (top view) 3 2 4 5 1 dck package sc70-5 (top view) fb/nc gnd nc outin outnc fb/nc in nc gnd gnd 12 3 65 4
tps714xx sbvs116c C december 2008 C revised march 2011 www.ti.com this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. available options (1) product v out (2) xx is nominal output voltage (for example 33 = 3.3v, 01 = adjustable) tps714 xxyyyz yyy is package designator z is package quantity (1) for the most current package and ordering information see the package option addendum at the end of this document, or see the ti web site at www.ti.com . (2) custom output voltages are available on a quick-turn basis for prototyping. production quantities are available; minimum package order quantities apply. contact factory for details and availability. absolute maximum ratings over operating temperature range, unless otherwise noted. (1) parameter tps714xx unit v in range C 0.3 to +24 v v out range - 0.3 to +9.9 v v fb range -0.3 to +4 v peak output current internally limited continuous total power dissipation see power dissipation rating table junction temperature range, t j C 40 to +125 c storage temperature range C 65 to +150 c human body model (hbm) 2 kv esd rating charged device model (cdm) 500 v (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. power dissipation rating table derating factor t a 25 c power t a = +70 c power t a = +85 c power board package r ja c/w above t a = +25 c rating rating rating high-k (1) dck 315 3.18mw/ c 320mw 175mw 100mw high-k (1) drv 65 15.4mw/ c 1.54w 850mw 0.62w (1) the jedec high-k (2s2p) board design used to derive this data was a 3 inch 3 inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board. 2 submit documentation feedback copyright ? 2008 C 2011, texas instruments incorporated
tps714xx www.ti.com sbvs116c C december 2008 C revised march 2011 electrical characteristics over the operating junction temperature range (t j = C 40 c to +125 c), v in = v out(nom) + 1v, i out = 1ma, and c out = 1 f, unless otherwise noted. the adjustable version is tested with v out = 2.8v. typical values are at t j = +25 c. tps714xx parameter test conditions min typ max unit i out = 10ma 2.5 10 input voltage range (1) v in v i out = 80ma 3 10 output voltage range v v out v fb 8.8 (tps71401) internal reference v v fb 1.12 1.20 1.24 (tps71401) tps71433 output voltage accuracy (1) over v in , i out , 4.3v < v in < 10v, 1ma i out 80ma 3.135 3.3 3.465 v and temp output voltage v out / v in v out + 1v < v in 10v 5 mv line regulation (1) load regulation v out / i out i out = 1ma to 80ma 30 mv feedback pin bias current i fb bias i out = 0ma, v in = 3v to 10v, v out = 1.2v, 2 na dropout voltage v do i out = 80ma, v in = v out(nom) C 0.1v 670 1300 mv output current limit i cl v out = 0v 100 1100 ma t j = C 40 c to +85 c, 1ma i out 80ma 3.2 4.2 ground pin current i gnd 1ma i out 80ma 3.2 5.8 a v in = 10v, 1ma i out 80ma 7.4 power-supply ripple psrr f = 100khz, c out = 10 f 60 db rejection bw = 200hz to 100khz, output noise voltage v in 575 vrms c out = 10 f, i out = 50ma (1) minimum v in = v out + v do , or the value shown for input voltage, whichever is greater. pin configuration drv package dck package son-6 sc70-5 (top view) (top view) table 1. pin descriptions tps714xx dck drv name fixed adj. fixed adj. description fb/nc - 1 - 4 adjustable version only. this pin is used to set the output voltage. gnd 2 2 3, pad 3, pad ground no connection. may be left open or tied to ground for improved thermal nc 1,3 3 2, 4, 5 2, 5 performance. in 4 4 1 1 unregulated input voltage. regulated output voltage. any output capacitor 0.47 f can be used for out 5 5 6 6 stability. copyright ? 2008 C 2011, texas instruments incorporated submit documentation feedback 3 outnc fb/nc in nc gnd gnd 12 3 65 4 3 2 4 5 1 fb/nc gnd nc outin
tps714xx sbvs116c C december 2008 C revised march 2011 www.ti.com functional block diagrams figure 1. adjustable voltage version figure 2. fixed voltage version 4 submit documentation feedback copyright ? 2008 C 2011, texas instruments incorporated gnd v = 1.205v ref fb r1r2 bandgap reference v in v out i lim current sense gnd v ref = 1.205v r1r2 840k w bandgap reference v in v out i lim current sense
tps714xx www.ti.com sbvs116c C december 2008 C revised march 2011 typical characteristics at t a = +25 c, unless otherwise noted. tps71433 tps71433 tps71433 output voltage output voltage quiescent current vs vs vs output current junction temperature junction temperature figure 3. figure 4. figure 5. tps71433 tps71433 tps71433 output spectral noise density output impedance dropout voltage vs vs vs frequency frequency output current figure 6. figure 7. figure 8. copyright ? 2008 C 2011, texas instruments incorporated submit documentation feedback 5 100 1k 10k 100k f frequency hz - - i out = 1ma i out = 50ma 0 1 2 3 4 5 6 7 8 v in = 4.3v v out = 3.3v c out = 1 m f output spectral noise density - m v/ ? hz f frequency hz - - z o - - output impedance w 14 80 12 2 4 10 v in = 4.3v v out = 3.3v c out = 1 m f t j = +25 c i out = 1ma 100 1m 10 1k 10k 100k 10m i out = 50ma 6 16 18 t junction temperature j - - c - 40 - 25 - 10 5 20 35 50 65 80 95 110 125 3.465 3.432 3.399 3.366 3.333 3.300 3.267 3.234 3.201 3.168 3.135 v dropout voltage do - - mv v in =4 .3v i out = 10ma i out = 80ma i output current out - - ma 0 10 20 30 40 50 60 70 80 3.4653.432 3.399 3.366 3.333 3.300 3.267 3.234 3.201 3.168 3.135 v output voltage out - - v v in = 4.3v 2.0 2.5 3.0 3.5 4.0 4.5 - 40 - 25 - 10 5 20 35 50 65 80 95 110 125 t junction temperature j - - c v in = 4.3v v out = 3.3v i out = 1 m f i ground current gnd - - a m i out - output current - ma 0 10 80 70 60 50 40 30 20 1000 900800 700 600 500 400 300 200 100 0 v do - dropout voltage - mv v in = 4.3v t j = +125 c t j = +25 c t j = - 40 c
tps714xx sbvs116c C december 2008 C revised march 2011 www.ti.com typical characteristics (continued) at t a = +25 c, unless otherwise noted. tps71433 tps71433 tps71433 power-supply ripple dropout voltage v out rejection vs vs vs junction temperature current limit frequency figure 9. figure 10. figure 11. tps71433 tps71433 tps71433 power-up/power-down line transient response load transient response figure 12. figure 13. figure 14. 6 submit documentation feedback copyright ? 2008 C 2011, texas instruments incorporated t junction temperature j - - c 1000 900800 700 600 500 400 300 200 100 0 v dropout voltage do - - mv v in = 4.3v i out = 80ma i out = 10ma - 40 - 25 - 10 5 20 35 50 65 80 95 110 125 i out - current limit - ma 0 100 200 300 400 500 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 v out - output vo ltage - v v in = 4.3v v out = 3.3v f - frequency - hz 0 8050 10 7020 30 60 v in = 4.3v v out = 3.3v c out = 10 m f t j = +25 c i out = 1ma 100 1m 10 1k 10k 100k 10m i out = 50ma 40 90 100 psrr - power supply ripple rejection - db t - time - ms - 0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.5 4.0 100 50 0 200 0 - 200 i out - output current - ma v out - output vo ltage - mv v in = 4.3v v out = 3.3v c out = 10 m f 0 150 100 50 200 250 350 300 400 450 500 5.3 v out = 3.3v i out = 50ma c out = 10 m f 4.3 100 50 0 - 50 t - time - ms v input voltage in - - v v output voltage out - - mv v in v out v out = 3.3v r l = 66 w c out = 10 m f 87 6 5 4 3 2 1 0 t time ms - - 0 2 4 6 8 10 12 14 16 18 20 v output voltage out - - v v input voltage in - - v
tps714xx www.ti.com sbvs116c C december 2008 C revised march 2011 application information the tps714xx family of ldo regulators has been optimized for ultralow power applications such as the msp430 microcontroller. its ultralow supply current maximizes efficiency at light loads, and its high input voltage range makes it suitable for supplies such as unconditioned solar panels. figure 15. typical application circuit (fixed voltage version) external capacitor requirements although not required, a 0.047 f or larger input bypass capacitor, connected between in and gnd and located close to the device, is recommended to improve transient response and noise rejection of the power supply as a whole. a higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated and if the device is located several inches from the power source. the tps714xx requires an output capacitor connected between out and gnd to stabilize the internal control loop. any capacitor (including ceramic and tantalum) that is greater than or equal to 0.47 f properly stabilizes this loop. power dissipation and junction temperature to ensure reliable operation, worst-case junction temperature should not exceed +125 c. this restriction limits the power dissipation that the regulator can manage in any given application. to ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, p d(max) , and the actual dissipation, p d , which must be less than or equal to p d(max) . the maximum-power-dissipation limit is determined using equation 1 : where: ? t j max is the maximum allowable junction temperature. ? r ja is the thermal resistance junction-to-ambient for the package (see the power dissipation rating table). ? t a is the ambient temperature. (1) the regulator dissipation is calculated using equation 2 : (2) power dissipation resulting from quiescent current is negligible. regulator protection the tps714xx pmos-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (for example, during power-down). current is conducted from the output to the input and is not internally limited. if extended reverse voltage operation is anticipated, external limiting might be appropriate. the tps714xx features internal current limiting. during normal operation, the tps714xx limits output current to approximately 500ma. when current limiting engages, the output voltage scales back linearly until the over-current condition ends. there is no internal thermal shutdown circuit in this device; therefore, care must be taken not to exceed the power dissipation ratings of the package during a fault condition. this device does not have undervoltage lockout; therefore, this constraint should be taken into consideration for specific applications. copyright ? 2008 C 2011, texas instruments incorporated submit documentation feedback 7 tps71433 in out v in v out c1 0.1 f m 0.47 f m gnd p d(max) t j max t a r ja p d v in v out i out
tps714xx sbvs116c C december 2008 C revised march 2011 www.ti.com programming the tps71401 adjustable ldo regulator the output voltage of the tps71401 adjustable regulator is programmed using an external resistor divider as shown in figure 16 . the output voltage is calculated using equation 3 : (3) where: v ref = 1.20v typ (the internal reference voltage) resistors r1 and r2 should be chosen for approximately a 1.5 a divider current. lower value resistors can be used for improved noise performance, but the solution consumes more power. higher resistor values should be avoided because leakage current out of the fb pin across r1/r2 creates an offset voltage that artificially increases the feedback voltage and thus erroneously decreases v out . the recommended design procedure is to choose r2 = 1m ? to set the divider current at 1.5 a, and then calculate r1 using equation 4 : (4) figure 16. tps71401 adjustable ldo regulator programming 8 submit documentation feedback copyright ? 2008 C 2011, texas instruments incorporated v out v ref 1 r1 r2 r1 v out v ref 1 r2 output voltage programming guide output voltage r1 r2 1.8v2.8v 5.0v 392m w 1.07m w 2.55m w 806k w 806k w 806k w v in fb gnd in 0.1 f m tps71401 out 0.47 f m v out r1r2
tps714xx www.ti.com sbvs116c C december 2008 C revised march 2011 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision b (december, 2009) to revision c page ? changed ground pin current maximum specifications ......................................................................................................... 3 changes from revision a (april, 2009) to revision b page ? changed battery type shown in typical circuit illustration ..................................................................................................... 1 ? changed v in range absolute maximum rating from +11.5v to +24v ................................................................................... 2 copyright ? 2008 C 2011, texas instruments incorporated submit documentation feedback 9
package option addendum www.ti.com 2-jun-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples TPS71401DCKR active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdauag level-1-260c-unlim -40 to 125 cvg tps71401dckt active sc70 dck 5 250 green (rohs & no sb/br) cu nipdauag level-1-260c-unlim -40 to 125 cvg tps71401drvr active wson drv 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cvg tps71401drvt active wson drv 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cvg tps71433dckr active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdauag level-1-260c-unlim -40 to 125 cvh tps71433dckt active sc70 dck 5 250 green (rohs & no sb/br) cu nipdauag level-1-260c-unlim -40 to 125 cvh tps71433drvr active wson drv 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cvh tps71433drvt active wson drv 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cvh (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature.
package option addendum www.ti.com 2-jun-2016 addendum-page 2 (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TPS71401DCKR sc70 dck 5 3000 180.0 8.4 2.41 2.41 1.2 4.0 8.0 q3 tps71401dckt sc70 dck 5 250 180.0 8.4 2.41 2.41 1.2 4.0 8.0 q3 tps71401drvr wson drv 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 q2 tps71401drvt wson drv 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 q2 tps71433dckr sc70 dck 5 3000 180.0 8.4 2.41 2.41 1.2 4.0 8.0 q3 tps71433dckt sc70 dck 5 250 180.0 8.4 2.41 2.41 1.2 4.0 8.0 q3 tps71433drvr wson drv 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 q2 tps71433drvt wson drv 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 q2 package materials information www.ti.com 2-jun-2016 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TPS71401DCKR sc70 dck 5 3000 202.0 201.0 28.0 tps71401dckt sc70 dck 5 250 202.0 201.0 28.0 tps71401drvr wson drv 6 3000 203.0 203.0 35.0 tps71401drvt wson drv 6 250 203.0 203.0 35.0 tps71433dckr sc70 dck 5 3000 202.0 201.0 28.0 tps71433dckt sc70 dck 5 250 202.0 201.0 28.0 tps71433drvr wson drv 6 3000 203.0 203.0 35.0 tps71433drvt wson drv 6 250 203.0 203.0 35.0 package materials information www.ti.com 2-jun-2016 pack materials-page 2

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